High-Performance Thermal Components for AI

In the era of rapidly rising artificial intelligence (AI) applications, the powerful performance brought by AI computing presents unprecedented challenges for hardware equipment. Whether it is high-end AI chips, HPC (high-performance computing) servers, or hyperscale data centers, these core systems are all facing thermal performance bottlenecks. The intense heat generated by AI chips during high-density computing places higher demands on fundamental hardware thermal management. The quality of thermal technology directly impacts the stability, lifespan, and performance of the chips.

Leveraging its deep expertise in aluminum die casting and innovative thermal management solutions, ALUNEX develops high-performance, lightweight, and reliable aluminum alloy heat dissipation components specifically designed for AI equipment, driving the stable evolution of artificial intelligence infrastructure.

ALUNEX’s Unique Technological Edge — Born for the Future of Thermal Management

1. Excellent Thermal Conductivity — 20% Improvement in Heat Dissipation Efficiency
   We utilize an improved series of aluminum alloys and employ precision die-casting technology to create heat dissipation modules with exceptionally high thermal conductivity. Compared to traditional materials, ALUNEX’s specialized solutions can efficiently channel the high heat generated by chips, maintaining optimal operating temperatures during prolonged high-load operation, significantly reducing the risk of overheating, and comprehensively enhancing system performance.
2. Precision Cooling Channel Design and Integrated Die-Casting
   Our die-casting technology enables the creation of ultra-precise internal cooling channels at the micron level (with errors below 0.1 mm). This not only optimizes liquid cooling flow rate and efficiency but also maximizes thermal management capability. In addition, ALUNEX adopts an integrated die-casting design, reducing thermal resistance issues commonly found at welded or assembled joints in traditional heat sinks. This ensures greatly improved heat transfer efficiency while lowering the risk of component failure, achieving higher stability and durability.
3. Lightweight Design and Flexible Customization
   Compared to traditional copper heat sinks, ALUNEX’s aluminum alloy modules are 40% lighter, achieving a lightweight structure while maintaining high thermal conductivity and efficient heat dissipation. Our flexible designs allow adaptation to various complex heat dissipation components, making them ideal for AI chips, data centers, and high-performance server equipment, meeting the thermal management needs of diverse application environments.

The Thermal Management Pioneer of the AI Era

As a leader in aluminum die-casting solutions, ALUNEX leverages professional thermal management technology and customized designs to help businesses confidently handle high computational loads, maximizing AI system energy efficiency and optimizing performance. Our solutions not only meet current thermal management needs but also focus on the future, serving as a cornerstone at the heart of AI.